The value -added manufacturing process, developed by our parent in Utsunomiya, Japan is also used in the manufacture of CRM (Clear Resin for Mounting),a Die-Attach Paste used for mounting of IC chip on the lead frame prior to encapsulation by the molding compund and CRP (Clear Resin for Potting),a thermal setting plastic in liquid form, used for the encapsulation of the IC chips. Our two lines produce 484kg of CRP and 300kg of CRM monthly. The manufacturing process follows strict controls and schedules to ensure high standards. From mixing and kneading, to defoaming and packing, our technicians give contant attention to producing the best CRM and CRP products to customer specification. Sample batches are tested regularly for compliance. Completed products are stored and delivered in climate-controlled conditions to your doorstep.
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